Optical head, optical information storage apparatus, and their fabrication method

ABSTRACT

A method of manufacturing an optical head includes joining of a first substrate on which a plurality of lenses are formed in an array, a second substrate on which a plurality of prisms and mirrors are formed in an array, and a third substrate on which a plurality of detectors and light sources are formed in an array, after positioning of the individual substrates, and cutting the joined substrates along the rows and columns of the array.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. application Ser.No. 11/211,438, filed Aug. 26, 2005, the contents of which areincorporated herein by reference.

CLAIM OF PRIORITY

The present application claims priority from Japanese application JP2005-052252 filed on Feb. 28, 2005, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an optical head for reproducing orrecording information on optical information storage media, an apparatusfor reproducing and/or recording optical information, and theirmanufacturing method.

2. Background Art

Optical disc units for CDs and DVDs are widely available examples ofoptical information reproducing apparatuses. In CDs, light with thewavelength of 780 nm is focused beyond a 1.2-mm thick substrate by anoptical head with the numerical aperture (NA) of 0.45. In DVDs, thewavelength is reduced to 650 nm, and the NA is increased to 0.6 so as toachieve higher capacities than CDs. As a result, the thickness of thesubstrate of the DVD is set to be 0.6 mm in order to reduce theinfluence of coma aberration that is produced when the disc is inclined.In recent years, large-capacity optical discs referred to as Blu-rayDiscs (BDs) have also been put on the market, in which a blue-violetlaser diode is used. In BDs, the NA of the objective lens is increasedto 0.85 for even greater capacities. At the same time, in order toreduce the influence of the tilting of the disc, the thickness of thesubstrate is reduced to 0.1 mm. In practice, however, a 0.1-mm thicksubstrate is unable to carry a 120-mm disc. Therefore, a 0.1-mm thickcover layer is provided on a 1.1-mm thick substrate, and light isfocused beyond the cover layer.

An example of an optical head used in such disc systems is disclosed inPatent Document 1 (JP Patent Publication (Kokai) No. 11-144297 A (1999).In this example, a semiconductor laser chip is integrally formed with aprism, a photodetector, and a substrate, and one such unit is stacked ontop of the other in two stages so as to handle the two kinds of opticaldiscs, namely CDs and DVDs, for example. Light emitted from such amodule is focused on a disc by an objective lens separately mounted onan actuator. The light is then reflected back to the same module, whereit is reflected in the prism and then received by the photodetector.

Another conventional example of an optical head is disclosed in PatentDocument 2 (JP Patent Publication (Kokai) No. 2004-103241 A), in which asemiconductor laser, a prism, and a photodetector are also combined intoa module. Light emitted by the module is also focused by an externallydisposed objective lens onto an optical disc and then returned back tothe module. This example differs from that of Patent Document 1 in thata diffraction grating is added to the module, whereby the reflectedlight from the optical disc is guided to the photodetector.

In yet another example of an optical head, Patent Document 3 (JP PatentPublication (Kokai) No. 2004-272951 A) discloses a module consisting ofa semiconductor laser and a photodetector. The module is furtherintegrated with an objective lens as well as a diffraction grating,which is disposed in an upright manner inside the module such that itcan act on the light from the semiconductor laser before it is reflectedby a mirror. In an optical disc unit based on this technology, theoptical head is mounted on a swing-arm actuator so that the entireoptical head can be actuated for reproducing a signal from the opticaldisc.

Patent Document 4 (JP Patent Publication (Kokai) No. 6-251410 A (1994),corresponding to U.S. Pat. No. 5,481,386) discloses yet another exampleof an optical head in which a surface-emission laser, a photodetector, adiffraction lens, and a diffraction grating are integrally fabricated ina module. The light emitted from the surface-emission laser is focusedon an optical disc by a diffractive lens, and the reflected light isguided to the photodetector by the diffraction grating. In an opticaldisc unit based on this technology, the optical head is disposed on aswing arm so that the entire optical head can be actuated forpositioning a light spot on a particular information track.

Patent Document 1: JP Patent Publication (Kokai) No. 11-144297 A (1999)

Patent Document 2: JP Patent Publication (Kokai) No. 2004-103241A

Patent Document 3: JP Patent Publication (Kokai) No. 2004-272951A

Patent Document 4: JP Patent Publication (Kokai) No. 6-251410A (1994)

SUMMARY OF THE INVENTION

As the capacity of optical discs increases, a transparent substrate or acover layer with which a recording film on the optical disc is coveredis gradually becoming thinner. As a result, not only has the size of theoptical spot on the recording film become smaller, but also the size ofthe optical spot on the surface of the substrate or the cover layer hasbecome smaller. Specifically, when the refraction index of the substrateis approximately 1.6 regardless of the wavelength, the size of theoptical spot on the surface of the substrate or cover layer is0.45/1.6×1.2×2=0.68 mm for CDs; 0.6/1.6×0.6×2=0.45 mm for DVDs; and0.85/1.6×0.1×2=0.11 mm for BDs. The beam size at a position spaced apartfrom the surface of the substrate or cover layer by approximately 0.1 mmis 0.68+0.45×0.1×2=0.77 mm for CDs; 0.45+0.6×0.1×2=0.57 mm for DVDs; and0.11+0.85×0.1×2=0.28 mm for BDs. Thus, as the thickness of the substrateor cover layer decreases, the beam size can be further reduced, wherebyit becomes possible in principle to reduce the size of lenses to such anextent that they can be integrated with a light source and aphotodetector. However, as the lens becomes smaller in size, otheroptical components must also be reduced in size, which would make itvery difficult to handle such components for assembly or adjustmentpurposes.

In Patent Document 1, although the semiconductor laser, photodetector,and prism are combined, the objective lens is not, which is not quiteadvantageous in terms of minimization of the optical system. Further,the prism must be individually affixed, resulting in a difficulty inhandling and an increased time for adjustment, thereby making itdifficult to achieve reduction in manufacturing cost.

In Patent Document 2, the objective lens is not integrated, as in PatentDocument 1, and therefore this prior art is not suitable for theminimization of the optical system as a whole. Further, with regard tothe prism, complex laminated prisms must be individually adjusted andaffixed to a semiconductor laser/photodetector module, resulting in anincreased adjustment time and manufacturing cost.

In Patent Document 3, although the objective lens is integrated, thenumber of components is large and adjustment is difficult, such thatreduction of manufacturing cost is difficult to achieve. Particularly,it is difficult to secure sufficient positioning accuracy for thediffraction grating because it is disposed in an upright manner in theoptical system.

In Patent Document 4, the objective lens is integrated and the entiremanufacturing process can be performed through a semiconductor process.However, if the full-width at half maximum of emission angle is narrow,the magnification of the optical system that is required for obtaining asufficiently small focused spot must be increased, which would result inan increase in the thickness between the laser and the objective lens.For example, when the full-width at half value of the emission angle oflaser is 10°, the effective pupil diameter of the objective lens is 0.5mm, and the ratio of the intensity of light beam at the outer-most edgeof the effective light flux through the objective lens to the intensityof the light beam at the center of the optical axis (RIM intensity) is0.2, the distance between the laser and the lens that is required wouldbe approximately 1.9 mm. When the thickness for laser and that of thelens are further added, the total required thickness could exceed 3 mm.

In view of these problems of the prior art, it is an object of theinvention to allow the objective lens to be integrated so that a thinand ultra-small sized optical head that is easy to assemble and adjustcan be provided.

In order to overcome the aforementioned problems, in accordance with theinvention, microlenses are fabricated on a transparent wafer in anarray. Cavities each with an inclined plane providing a prism and areflecting mirror are fabricated on another transparent substrate in anarray. And photodetectors are fabricated on a semiconductor substrate,such as that of silicon, in an array. Light sources are also affixed tothe semiconductor substrate. The prism/mirror substrate, the lenssubstrate, and the semiconductor substrate are then joined together andthe joined substrates are thereafter cut so as to produce optical heads.The light source comprises a semiconductor laser of the Fabry-Perottype, which is currently easily convertible for higher outputs. Theemitted light is directed vertically upwards using a mirror before it isfocused on the disc. Reflected light is incident on the mirror surfacevia the lens, transmitted and refracted by the mirror surface, reflectedby the bottom and top surfaces of the prism substrate, and then guidedto the photodetector.

For size reduction purposes, the effective light flux diameter of theobjective lens is set to be not more than 0.5 mm, and the thickness of acover layer of the optical information storage medium is set to be notmore than 0.1 mm. In this way, the thickness of the integrated opticalhead can be reduced to be 2 mm or smaller. In the recent laptopcomputers, a slot capable of accommodating a name-card sized card calleda PC card with a thickness of approximately 5 mm is mounted as avirtually standard component. If an optical head with a thickness of 2mm or smaller can be realized, it would be possible to achieve athickness of a notebook computer of 5 mm or smaller, providing for 0.6mm for the thickness of the medium, 0.2 mm for the thickness of thecasing, both at the top and bottom, 1 mm for the thickness of thecircuit substrate or the like, 0.4 mm for the spacing between the headand the disc in consideration of the disc plane fluctuations, and 0.8 mmfor the thickness of the substrate for the stator of the spindle motorin addition to the thickness of the optical head.

For ease of assembly and better dissipation of heat from the laser, thecavities in the prism/mirror substrate are provided by throughholes, andthe semiconductor lasers are mounted on the semiconductor substratebefore the prism/mirror substrate and the lens substrate are joinedtogether.

Because the semiconductor substrate, prism/mirror substrate, and lenssubstrate are cut only after they have been joined together, each of thesides of the individual substrates or the optical heads is placed in thesame plane.

The lenses are fabricated by joining a collimator lens and an objectivelens for achieving higher NA.

The refracted ray transmitted through the prism has an extended opticalpath if the magnification of the optical system is to be ensured.Therefore, the refracted ray is caused to enter the detector after beingreflected by the bottom and top surfaces of the prism/mirror substrateonce or more.

The thus produced optical head is disposed on an actuator, which isdriven as a whole so as to position the head on a particular informationtrack on the optical information storage medium.

The thus produced optical head comprises a first substrate with a lensfor focusing light on an information storage medium, a second substratewith a detector disposed on the surface thereof, and a layer disposedbetween the first and second substrates and having a prism and a mirror.The layer also includes a cavity in which a light source is disposed.The light emitted by the light source is reflected by the mirror, passesthrough the lens, and is then focused on an external information storagemedium. Reflected light from the information storage medium then passesthrough the lens and the prism and is then detected by the detector.Preferably, the light is reflected by the bottom and top surfaces of theprism/mirror substrate once or more before it is incident on thedetector.

Because the optical head of the invention is manufactured with thelenses, mirrors, prisms, light sources, and photodetectors alreadydisposed on the wafers, and adjustments are made with reference toalignment marks or the like, ultra-small optical heads can bemanufactured accurately in large quantities at low cost withoutrequiring the handling of small components for adjustment purposes.

By causing the light beam to be incident on the detector after beingreflected by the bottom and top surfaces of the prism/mirror substrateonce or more, the magnification of the optical system can be increasedwhile the thickness of the prism/mirror substrate is reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows the basic configuration of an optical head according to theinvention.

FIG. 2 shows a lateral cross section of FIG. 1.

FIG. 3 shows an exploded view of the components of the optical headshown in FIGS. 1 and 2.

FIG. 4 shows a conceptual chart of a manufacturing process.

FIG. 5 shows individual wafers as joined together.

FIG. 6 shows a conceptual chart of how the joined wafers are cut so asto produce optical heads.

FIG. 7 shows a process of producing a lens substrate and a prismsubstrate.

FIG. 8 shows a second embodiment of the optical head according to theinvention.

FIG. 9 shows a top view of FIG. 8.

FIG. 10 shows a table of optical constants for the embodiment shown inFIG. 8.

FIG. 11 shows a table of aspheric coefficients for the aspherical planesshown in FIG. 10.

FIG. 12 shows spot aberration characteristics on the disc surface in theoptical system shown in FIG. 8.

FIG. 13 shows the on-disc defocus dependency of an optical spot betweendetectors.

FIG. 14 shows detector patterns and signal computation formulae.

FIG. 15 shows the on-disc defocus dependency of an optical spotdistribution on a detector.

FIG. 16 shows a focus error signal.

FIGS. 17A and 17B show an embodiment of a ultra-small optical disc unitemploying an optical head of the invention.

FIG. 18 shows an optical head according to another embodiment of theinvention.

FIG. 19 shows a top view of the embodiment shown in FIG. 18.

FIG. 20 shows detector patterns and signal computation formulae for theembodiment shown in FIG. 18.

DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION

Preferred embodiments of the invention will be hereafter described withreference to the attached drawings.

Embodiment 1

FIG. 1 shows the basic structure of an optical head according to theinvention. The optical head comprises a silicon substrate 101 on whichphotodetectors 102 and 103 are fabricated and further a semiconductorlaser 104 of the Fabry-Perot type is mounted. On top of the siliconsubstrate, a prism/mirror substrate 107 with a cavity 106 having areflecting mirror 105 is bonded. On top of the prism/mirror substrate,there is further bonded a lens substrate 109 with an objective lens 108fabricated therein. The four sides of the individual substrates arealigned such that each side is substantially in the same plane. By“substantially in the same plane” herein is meant that the plane mayinclude some surface irregularities that are produced in practice whensuch layered substrate wafers are diced in a manufacturing process, aswill be described later.

FIG. 2 shows a lateral cross section of the optical head shown in FIG.1, additionally showing a light flux 201 and an optical informationstorage medium 202. The light flux 201, which is emitted by thesemiconductor laser 104, is reflected by the reflecting mirror 105 andis then focused on a recording film 203 on the optical informationstorage medium 202 through a cover layer 204. Reflected light is againincident on the objective lens 108 and then transmitted and refracted bythe reflecting plane of the reflecting mirror 105. Some of the light isincident on the photodetector 102 as a detection signal, and the rest isfurther reflected at the plane of junction between the lens substrate109 and the prism/mirror substrate 107 before it is received by thephotodetector 103.

FIG. 3 shows an exploded view of the optical head shown in FIGS. 1 and2. The semiconductor laser 104 is mounted on the silicon substrate 101,and the silicon substrate 101 and the prism/mirror substrate 107 arebonded to each other such that the semiconductor laser 104 is completelyhoused within the cavity 106 of the prism/mirror substrate 107. On topof this, the lens substrate 109 is bonded. When mounting thesemiconductor laser 104, a transmitted image of an active laser stripe(not shown) of the semiconductor laser or an alignment mark (not shown)patterned on the surface of the semiconductor laser is aligned with analignment mark (not shown) on the silicon substrate, before thesemiconductor laser 104 is fixed in place using solder, which ispatterned on the silicon substrate in advance.

By thus causing the light beam to be reflected by the top and bottomsurfaces of the prism/mirror substrate at least once before the lightbeam is incident on the detectors, the magnification of the opticalsystem can be increased while the thickness of the prism/mirrorsubstrate is reduced. The “magnification of the optical system” hereinrefers to the ratio of the effective NA on the light source side to theNA on the image side. Particularly when an infinitive objective lens iscombined with an infinitive collimator lens, the magnification would beequal to the ratio of the focal distance of the collimator lens to thefocal distance of the objective lens. In other words, when the distancebetween the light source and the lens is increased so as to increase theRIM intensity with a narrow laser emission angle, the distance requiredfor the refracted light beam within the prism to converge alsoincreases. And the increase is accommodated by increasing the number ofreflections using the prism/mirror substrate.

FIG. 4 shows the basic concept of an actual manufacturing process. On asilicon wafer 401, photodetectors 102 and 103 are prepared in an array,and semiconductor lasers 104 are mounted for individual photodetectors.The silicon substrate is provided with a plurality of alignment marks404, with which alignment marks 405 on a prism/mirror substrate wafer402 and alignment marks 406 on a prism/mirror substrate wafer 403 arealigned when the wafers are bonded together. When bonding the lenssubstrate wafer 403 and the prism/mirror substrate wafer 402, a UV resinmay be placed between them and irradiated with UV light, for example. Inthis case, the amount of resin must be carefully measured so that theresin is evenly applied to each cell without overflowing into thecavity. For the bonding of the prism/mirror substrate 402 and thesilicon wafer 401, methods other than the aforementioned methodinvolving a UV-cured resin may be employed, such as anodic bonding.

FIG. 5 shows the result of bonding the substrates of FIG. 4. FIG. 6shows a schematic diagram of a number of optical heads prepared bycutting the bonded substrates. In FIG. 6, because the cutting isperformed after the three substrates have been bonded together, each ofthe four sides of the optical head after cutting is substantiallydisposed in the same plane.

FIG. 7 shows a process of manufacturing the lens wafer 403 and theprism/mirror substrate wafer 402. A glass substrate 701 is coated with aphotoresist 702 and then exposed with a gray scale photomask 703, whichhas a light and shade pattern on it, placed closely on the substrate.When the exposed substrate is developed, a lens shape and a prism shapeare formed on the resist. By dry-etching these shapes using C₄F₈ gas,for example, the shapes can be transferred onto the glass.Alternatively, for the prism substrate, for example, a mold may beprepared by machining and a pattern formed on it may be transferred to aglass or plastic substrate.

Thus, the prism/mirror substrate with cavities provided therethrough isbonded after the semiconductor lasers are mounted on the semiconductorsubstrate. As a result, heat can be readily dissipated from thesemiconductor lasers through the semiconductor substrate, which hasbetter heat conductance than glass or plastic. Further, mounting thesemiconductor laser chips without there being any blocking parts insurrounding areas makes it easier to handle the semiconductor laserchips than if the semiconductor laser chips are placed in the cavitiesand then adjusted.

Because the semiconductor substrate, prism/mirror substrate, and lenssubstrate are bonded together before they are cut, the sides of theindividual substrates can be each placed in the same plane. As a result,stress concentration does not easily occur and the resultant shape ofthe optical head facilitates its mounting on an actuator.

Furthermore, because the lens substrate is prepared by bonding anobjective lens and a collimator lens together, the NA of the objectivelens can be easily increased.

Embodiment 2

FIG. 8 shows a second embodiment of the invention. Light emitted by asemiconductor laser 104 is reflected by a reflecting mirror 105 and thenturned into parallel beams by a collimator lens 802. The beams are thenfocused by an infinity objective lens 804 on a recording film on anoptical information storage medium 202 through a cover layer 204 with athickness of 0.1 mm. The semiconductor laser 104 is mounted on aradiating stem 801 made of SiC. The collimator lens 802 is comprised ofan aspherical surface formed on either side of a collimator lenssubstrate 803. In order to reduce the distance between the end of thesemiconductor laser 104 and the collimator lens 802 as much as possiblewhile maintaining a constant focal distance, the collimator lens 802 hasa meniscus shape. The objective lens 804 is an aspherical lens formed oneither side of the objective lens substrate 805 with an effective pupildiameter of 0.5 mm and NA of 0.85. The side of the objective lens 804towards the recording medium is raised from the surrounding areas of thesubstrate by approximately 0.1 mm so as to reduce the possibility ofcollision with the cover layer 204. The reflected light is then againincident on the reflecting surface of the reflecting mirror 105 and thentransmitted and refracted by the reflecting surface. The light is thenreflected by the bottom and top surfaces of the prism/mirror substrate107, and some of the light is then received by the photodetector 102.The rest is reflected by the photodetector 102 and again reflected bythe top surface before it is received by the photodetector 103. Thus,the light emitted by the light source 104 is reflected a plurality oftimes between the plane of junction with the second substrate 101 andthe plane of junction with the first substrate 803 before it is receivedby the detectors. Therefore, the magnification of the optical system canbe increased while reducing the thickness of the prism/mirror substrate.Electric wires are connected to the semiconductor laser 104 andphotodetectors 102 and 103 via throughholes 806, 807, 808, and 809 inthe bottom surface of the silicon substrate 101. Electric inputs andoutputs to the optical head are provided via flexible plastic cables(FPCs), which are not shown, through the bottom surface of the siliconsubstrate 101. The thickness of the optical head is 2 mm in total, andits length is 4.2 mm.

FIG. 9 shows a top plan view of the optical head of FIG. 8. The opticalhead has a width of approximately 2 mm.

FIG. 10 shows a table of optical constants of the optical head shown inFIG. 8. “TYPE” indicates the type of plane, such as S for spherical orplanar plane, A for an aspherical plane, SDM for a planar or sphericalmirror with the center of plane displaced from optical axis, and SD fora planar or spherical plane with the center of plane displaced from theoptical axis. “RADIUS” indicates the radius of curvature of the plane inmillimeter units. “Infinity” indicates that the radius of curvature isinfinite and therefore the plane is planar. “DISTANCE” indicates thedistance from the plane that is located immediately behind in millimeterunits; negative values show that the distance is that between the planesafter an odd number of times of reflection. “STO” indicates that theplane has an aperture. Glasses are all M-LAF81, the wavelength is 405nm, and “INDEX” indicates the refraction index under these conditions.The refraction index values assume negative values after an odd numberof times of refractions. “APE-Y” indicates the radius of each planeshown in a light-beam tracing chart, which is indicated in millimeterunits. Because the radius of aperture in the STO plane is 0.25 mm, it isseen that the effective pupil diameter of the objective lens is 0.5 mm.“AP” indicates the shape of the aperture in each plane, such as C forcircular and R for rectangular. “ADE” indicates the inclination of theplane. It is indicated that the seventh plane is the recording film ofthe information storage medium and that the same planes as those of theincoming path are tracked in the opposite direction until the 13^(th)plane. The 14^(th) plane and subsequent planes are the reflecting planeswithin the prism.

FIG. 11 shows the aspherical coefficients of the aspherical planes ofFIG. 10. The second and third planes of FIG. 10, which are the bothsides of the collimator lens 802, are each indicated to be an asphericalplane given by the aspherical coefficients shown in the table. The4^(th) plane (aperture plane) and the 5^(th) plane are the both sides ofthe objective lens 805. The aspherical equation is given by:$\begin{matrix}{{z(r)} = {\frac{r^{2}}{R + \sqrt{R^{2} - {\left( {k + 1} \right)r^{2}}}} + {Ar}^{4} + {Br}^{6} + {Cr}^{8} + {Dr}^{10}}} & (1)\end{matrix}$

FIG. 12 shows the field-angle characteristics of wave aberration ofoptical spot on the recording film shown in FIG. 8. The characteristicsare plotted while varying the wavelength by ±5 nm from 405 nm, each plotrepresenting the wave aberration at the best focus. The result showsthat generally favorable focusing characteristics are obtained.

FIG. 13 shows the spot distribution on the upper plane of theprism/mirror substrate between the photodetectors 102 and 103 that wasobtained while varying the amount of defocus on the disc, namely, thedistance between the objective lens 804 and the cover layer 204. It canbe seen that astigmatism is produced on the detectors. This is due tothe fact that the convergent light is incident on an inclined refractiveplane, which cannot be avoided in the optical system of FIG. 8. Theastigmatism, however, does not have any influence on the optical spot onthe disc surface and does not pose any problems as long as focal pointdetection and tracking detection can be carried out.

FIG. 14 shows detector patterns for detecting a focal error signal and atracking error signal from a spot with astigmatism, as in the case ofthe optical spot shown in FIG. 13. The figure also shows signalcomputation formulae. A band-shaped photodetector consisting of threesections and another consisting of six sections are disposed in front ofand behind, respectively, the focal point. Individual output signals arecalculated in accordance with the computation formulae shown so as toobtain an FES (focus error signal), a TES (tracking error signal), andan RFS (radio frequency signal). k is a computational gain for thecorrection of imbalance in the total amount of light in front of andbehind the focal point.

FIG. 15 shows the results of computing the distribution of lightincident on the photodetectors shown in FIG. 14 while varying the amountof defocus on the information storage medium. The numbers on the left ofthe drawing indicate the amount of defocus. It can be seen from theseresults that the focus error signal can be obtained by the calculationformulae of FIG. 14. It can also be seen that the imbalance in intensityin the direction perpendicular to the tracks of the recording medium canbe detected by the photodetector located on the further side, and thatthe tracking signal based on the push-pull system can also be calculatedusing the calculation formulae of FIG. 14.

FIG. 16 schematically shows a resultant focus error signal. It can beseen that there is a range of approximately ±2 μm for focus errordetection.

Embodiment 3

FIGS. 17A and 17B show an embodiment of a small-sized optical disc unitutilizing a ultra-small optical head 1701 according to the invention.FIG. 17A is a plan view, and FIG. 17B is a side view. The small opticalhead 1701 is mounted on an actuator arm 1708, which can be moved finelyby a focus actuator 1707 in the direction of the optical axis of theobjective lens in the optical head. The actuator arm 1708 and the focusactuator 1707 are fixed to a swing arm 1703, together with a counterbalance 1705. The swing arm 1703 is driven by a swing motor 1704 so asto move the small optical head 1701 in the radius direction of anoptical disc 1709. The optical disc 1709 is rotated by a spindle motor1702. Input and output of signal to the optical head are enabled byflexible plastic cables (not shown) connected to a control circuit 1706.

When the thus prepared optical head is mounted and driven on anactuator, a large amount of disc eccentricity can be dealt with evenwhen the effective pupil diameter of the lens is reduced. Inconventional optical discs, the disc eccentricity is handled through theactuation of only the lens mounted on the actuator. In this case,however, the axis of the lens with respect to the fixed optical systemmoves. As a result, when the push-pull method is employed where thetracking signal is detected on the basis of the distribution of thereflected light, an offset is produced by the shifting of the lens,whose influence becomes greater as the diameter of the effective lightflux becomes smaller. To avoid this, a differential push-pull method isemployed in DVDs, for example, whereby three beams of light arecollected on the disc, and the offset is canceled by a differentialcomputation of push-pull signals from sub-spots on either side and apush-pull signal from the main spot. However, the optical system inwhich three spots are collected requires a diffraction grating or thelike. Such system also has disadvantages such as a reduction in theefficiency of optical utilization of the main spot due to the presenceof the sub-spots, or the generation of unwanted stray light. Inaccordance with the above-described embodiment of the invention,however, the optical head can be easily reduced in size and integrated,so that the optical head can be driven integrally and therefore thegeneration of offset can be prevented.

Embodiment 4

FIG. 18 shows another embodiment of the invention, in which aquarter-wave plate 1801 with a thickness of approximately 0.1 mm isinserted between an objective lens 804 and a collimator lens 802. Aplane is formed in the peripheral areas of each lens that is flat andprotruding from the lens planes, and the quarter-wave plate 1801 issandwiched between these planes. In this way, the quarter-wave plate1801 can be fixed between the objective lens substrate 805 and thecollimator lens substrate 803, using an adhesive agent (not shown) orthe like, without the plate coming into contact with the lens faces. Thecrystal axis direction of the quarter-wave plate 1801 is adjusted suchthat the transmitted light of the linearly polarized light incident onthe quarter-wave plate 1801 becomes circularly polarized light. When thereflected light from the recording film 203 passes through the objectivelens 804 again and further passes through the quarter-wave plate 1801again, the light is converted into linearly polarized light with thedirection of polarization rotated by 90° with respect to thepolarization of the light that was initially incident on thequarter-wave plate 1801. When the surface of the reflecting mirror 105is coated with a multilayered film (not shown) by vapor deposition, forexample, such that the s-polarized light is reflected and thep-polarized light is transmitted by the reflecting mirror, the reflectedlight from the disc can be again reflected by the reflecting mirror andprevented from returning to the semiconductor laser 104. In this way,noise components in the intensity of laser oscillation induced by thereturning light to the semiconductor laser 104 can be reduced. In thepresent embodiment, the thickness of the optical head as a whole wouldhave to increase in principle due to the addition of the quarter-waveplate, as compared with the embodiment of FIG. 8. However, the thicknessis controlled to be the same as that of FIG. 8 through a review of thedesign of the collimator lens 802 and an enhancement of the beamenlarging effect. Further, in the present embodiment, the positionwithin the prism/mirror substrate 107 where the light is most focused inthe plane of the drawing sheet is the fifth point of reflection, and thephotodetectors 102 and 103 for the detection of focal point error aredisposed at the third and seventh points of reflection, respectively. Atthe fifth point of reflection, there is also newly disposed aphotodetector 1802, the output of which is used as a reproductionsignal. Thus, the need to use a separate-type photodetector fordetecting a reproduction signal is eliminated, thereby improving thesignal-to-noise ratio of the RF signal.

FIG. 19 shows a top plan view of the optical head of FIG. 18.

FIG. 20 shows the arrangement of photodetectors for signal detection andformulae for signal calculation in the present embodiment. As mentionedabove, by using the output signal from the photo-detecting region at thecenter as the RF signal, the SIN ratio of the reproduction signal can beimproved. Generally, signals from separate light-receiving portions areonce subjected to current-to-voltage conversion and amplification in anamplifier, before they are subtracted or summed. In this process,amplification noise is added from the amplifier into the calculatedsignal, the amount of such noise corresponding to the number ofcontributing amplifiers. This is why it is desirable to detect the RFsignal, whose S/N ratio is particularly necessary to be improved, usinga single light-receiving portion and perform current-to-voltageconversion and amplification in a single amplifier.

In accordance with the invention, the optical head in an opticalinformation reproduction apparatus can be minimized to a very highdegree, adjusted easily, and manufactured at low cost. The inventionallows the optical disc units with large capacities to be greatlyreduced in size such that they can be mounted on cellular phones, forexample. As a result, a greater variety of applications can be utilizedon cellular phones. Furthermore, by utilizing the technology of theinvention on video cameras, it becomes possible to realize video cameraswith sizes comparable to those of digital cameras. When a plurality ofsuch ultra-small optical heads are mounted on a single optical disc unitso as to allow information to be recorded or reproduced in parallel, thetransfer rate can be effectively enhanced.

1. A method of manufacturing an optical head, comprising the steps of:joining a first substrate on which a plurality of lenses are formed inan array, a second substrate on which a plurality of prisms and mirrorsare formed in an array, and a third substrate on which a plurality ofdetectors and light sources are formed in an array after positioning theindividual substrates; and cutting the joined substrates along the rowsand columns of the array.
 2. The method of manufacturing an optical headaccording to claim 1, wherein said second substrate includes cavitiesformed therethrough and arranged in an array, wherein said secondsubstrate is positioned such that said light sources can be disposed insaid cavities.
 3. The method of manufacturing an optical head accordingto claim 1, wherein said first, said second, and said third substratesare each provided with an alignment mark, and wherein said first, saidsecond, and said third substrates are joined together by aligning saidalignment marks with one another.